Numerical analysis of design factors in manufacturing for improved energy efficiency

Abstract

The present research has been conducted to make electronic equipment more energy efficient by analyzing the design parameters during manufacturing. Many improvements have been made to packaging and cooling for steady-state power conversion applications. Pulsed systems, on the other hand, have different traits that require a trade-off between a high thermal efficiency of the package to slow down a rapid rise in temperature and a low thermal resistance to get rid of heat quickly. In thermal management for electronics, much work has gone into making cooling solutions for steady-state operation. However, in the modern era, heat management and thermal stress analysis have made it simple for an instrument to achieve improved performance as the equipment and devices’ lifecycles have increased. Electronic devices are being employed more often in applications with changing workloads. Functionality and dependability of various materials used in electronic devices and packaging; transient thermal management solutions have become crucial. In this review, we look at new requirements for transient thermal management and present cooling solutions for these applications found in the literature, focusing on the time scales of thermal response. Numerical analysis was done using ANSYS, fluent in evaluating the heat transfer dependency on aspect ratio, Rayleigh number and orientation. Result showed that with increase in Rayleigh number and aspect ratio, the heat transfer rate also increased with a reduction in thermal stresses.